Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Tue Mar 06 19:45:52 EST 2007 | davef
DPAK align on the tab with leaded solders. They don't align much with unleaded solders, but we know that your Indium NC-SMQ 92J is leaded. So, there may be too much paste on the heat sink tab causing the component to float [or wim] during reflow. If
Electronics Forum | Thu Mar 08 04:39:05 EST 2007 | stimpk
Hello, For the most part the ground side width should be reduced, but more than likly you are well into a run of built pcbs? Profiles may or not help in cases of the dreaded DPACK. No issues on any other areas or components so I'd stay away from t
Electronics Forum | Thu Mar 08 15:21:43 EST 2007 | pima
To be honest this product its only a part of bigger PCB, so we have only substrate with 3 FETs on it so no other components at substrate occurs and all substrate are staying at metal fixture. WE have already window pan aperture. WE producing this pro
Electronics Forum | Wed Apr 25 07:57:36 EDT 2001 | wbu
Steve: Try to find something that�s common to all your skewed parts. We haven�t had much trouble with it except for some MELF diodes a couple of years ago which didn�t look well aligned but made no trouble with specs. Better suited pad design solved
Electronics Forum | Tue Sep 20 12:38:05 EDT 2005 | Mark
Hallo, I have a problem with Topaz Xi with FNC nozzles. We have front, back and single camera in Topaz Xi. When i am using front camera and placing SO8, TSSOP14, TSSOP16 etc, using nozzles 73F the accurancy is ok. But when i switch to the back cam
Electronics Forum | Wed Sep 28 20:54:04 EDT 2005 | Ken
I would run scale calibration first (for the suspect camera). That may be your only problem. However, if your having a rotation issue and all major angles are off (differently) then it is most likely R-axis accuracy. However, I would run AMF and
Electronics Forum | Thu Mar 08 14:30:45 EST 2007 | ratsalad
If you are in the middle of a run and can't get a replacement stencil there immediately, you can always put a little kapton tape on the bottom of the stencil to mask off a portion of the DPAK pad and reduce the paste deposit. We have had to do this
Electronics Forum | Thu Aug 03 12:51:20 EDT 2006 | Ofer Cohen
I'd appreciate your support in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT co
Electronics Forum | Thu Aug 03 12:51:59 EDT 2006 | Ofer Cohen
I'd appreciate advise in the following issue: A significant batch of PCBs failed on de-lamination. The failure was identified, of course, only after the assembly. There is a big variety of components (BGA 1mm, BGA 0.8 mm, FQPs and other SMT componen
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