Electronics Forum | Sun Sep 04 01:59:41 EDT 2005 | smartasp
We need to dry and clean the air in our dedicated poting and conformal coating room. Can anybody help on how to go about it. The airconditions only recycle and dry until room temperature is reached and therefore have great fluctuations and unstable p
Electronics Forum | Fri Jan 27 15:12:48 EST 2006 | GS
From technical point of view: it should not be a problem to mix Pb with Pb Free components soldered with a LF solder process. You have to take care about the max temperature allowed on your Pb components and make sure they can withstand the higher
Electronics Forum | Mon May 06 21:40:40 EDT 2013 | davef
ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity limits
Electronics Forum | Wed Jul 11 14:44:21 EDT 2007 | fredericksr
Hi folks! Has anyone ever successfully verified adequate ESD control at
Electronics Forum | Fri May 14 09:00:35 EDT 2010 | rafacadiz
I attached a RX picture. A lot of voids and micro balls arround the flux residue. What do you think, relow temperature reflow or OSP poor weeting.? I appreciate your comments. Thanks,
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Wed Aug 23 19:01:54 EDT 2000 | kbmacg
For high temperature electronics, operating in 225�C ambient environments, most solders can not be used. The high-lead solders all have difficulties of one sort or another. Is their anything new regarding useful high melting point solders? Especially
Electronics Forum | Thu Apr 18 23:56:27 EDT 2002 | Abelardo Rodriguez
I'm trying to get a better understanding of the cooking process of pcb's. The use of nitrogen in reflow and wave ovens. Seems to have a wide margin of acceptance as a standard gas to prevent oxidation of metals in the board. Has any one heard or us
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
