Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Fri May 01 08:15:36 EDT 2009 | davef
Scavenging Methods [Improve Solder Scavenging of Large Area-array Sites, SMT, Laurence Harvilchuck, process research engineer, Unovis Solutions, harvilch@unovis-solutions.com] Two common methods exist for scavenging residual solder on the site for s
Electronics Forum | Wed Aug 05 20:48:50 EDT 1998 | Ron Costa
I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has anyon
Electronics Forum | Mon Apr 18 12:28:33 EDT 2005 | davef
We've never heard of it either. Stained glass widow people use varous types of copper and brass tape / foil in their work. A widely used suppler of this tape is Venture [ http://www.venturetape.com ]. They may be able to help. We're not sure how
Electronics Forum | Fri Jul 10 07:34:00 EDT 2020 | elijah
From the poor bonding strength of the board, the surface quality problems of the board are divided into: 1. The cleanliness of the board surface; 2. The problem of micro graphite (or surface energy) on the surface. PCB circuit board proofing Youke bo
Electronics Forum | Thu Feb 13 10:38:51 EST 2003 | davef
Given that you are bridging front to back, contast the situation with the thiefs used to prevent bridging when wave soldering SOIC. If this is reasonable, the thiefs should be located behind the trailing connector pins. You can prove-out this [and
Electronics Forum | Tue Apr 01 11:50:08 EST 2003 | rdr
Dave, thanks for the info. This sounds like it would verify the presence of an open. We have verified that these balls are open and I am trying to figure out if we are fracturing or not wetting. causing these opens. I would use the die method on ne
Electronics Forum | Wed Jun 08 17:35:04 EDT 2016 | slthomas
We all know that whenever possible, we want thermal relief between the barrel/pad and the copper foil to make it easier to properly solder that through hole connector. My question is, assuming there is no connection from the barrel to a copper layer
Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng
Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500
Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW
| I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any
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