Electronics Forum: copper foil reflow (Page 8 of 50)

Re: Tombstones

Electronics Forum | Fri Aug 07 10:14:43 EDT 1998 | RWW

I'm currently running a double sided paste smt board loaded with 0603's, on the secondary side. Many of the 0603 devices tombstone during reflow if the parts are not perfectly centered on the pads. Is this caused by the .008 foil thickness? Has any

Double sided smt

Electronics Forum | Sun Oct 31 19:39:26 EST 1999 | Pat Copeland

Parts are falling off on first side when reflowing second side, have tried changing temp profiles, and ended up using tin foil. any recomendations.

Invar Stencils

Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil

OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Reflow soldering problems and traces under component

Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz

Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen

Bare Copper Pad Reflow Soldering

Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee

I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate

BGA rework

Electronics Forum | Tue Apr 27 14:14:10 EDT 2004 | finepitch

Steven, While agreeing with your method here, I also would like to ask a question since we're right on that subject. Have you ever experienced problems with IR heating while working with a Heat-Slug BGA, or a Viper BGA where the whole top is covere

HASL for small pitch devices

Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch

Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac

Axial capacitor Pull out force

Electronics Forum | Tue Aug 21 20:52:06 EDT 2007 | davef

There is not standard for the force to pull an axial lead from a soldered connection. ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some lea


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