Electronics Forum | Mon Aug 01 06:59:02 EDT 2005 | Joseph
Dear all, We observed visible micro crack at top side of solder fillet during lead free wave solder process. We did not see any visible micro crack at bottom side, and it always located at joints of transformer. Any input be much appreciated. Best
Electronics Forum | Tue Aug 30 17:02:16 EDT 2005 | stepheniii
Check them before the oven for cracks. (after placement) Don't just look at them, take them off the board and check. I"ve seen resisters that were broken by the machine but you couldn't tell untill you took them off. If they are cracked check the co
Electronics Forum | Tue Oct 25 13:55:26 EDT 2005 | Joe Wesley
Looking for idea''s on how to reduce cracking of components along viscore. We are placing within 0.020 and0.030 from edge in some cases but are seeing cracks on components placed all the way out at 0.150 off edge. Has anyone heard heating the boards
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Sat Nov 17 18:16:46 EST 2007 | jwsmt
You mention moisture in the part as a cause of cracking during reflow. What does this type of crack look like? How was it determined that moisture was the culprit? The resonator is near the middle of the PCB, but is about 5mm from a large hole (abo
Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Mon Sep 19 07:34:14 EDT 2011 | henrytcx89
I would like to ask a few things about die crack. 1. I would like to know what could possibly be the root cause of die crack in die preparation? (Saw machine? Pick and Place machine?) 2. May I know how could I solve the problem? Thank you very muc
Electronics Forum | Sun May 26 02:06:39 EDT 2019 | jlawson
Placement force can cause chip cracking-micro cracks also. As machines are getting faster they tend to not control force other than spring pressures and z displacements. There are some machines that have full closed loop place pressure control , but
Electronics Forum | Wed Nov 13 02:28:27 EST 2019 | trino
Hello, I am a Japanese engineer. I am sorry for my unskillful English. Have you ever encountered cracks in chip resistors or IC components due to board mechanical stress? Especially, I'm looking for a case in the PCBs Depaneling process(pizza cutte
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
