Electronics Forum: de wetting (Page 8 of 8)

Soldering to brass?

Electronics Forum | Tue Aug 07 19:32:40 EDT 2007 | davef

Zinc from the brass diffuses into the solder and reacts with tin causing dezincification. Dezincification is a specific type of de-alloying, or selective, leaching corrosion of brass fittings. This type of corrosion selectively removes zinc from th

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Thu Aug 01 13:04:57 EDT 2002 | gdstanton

Its interesting. It appears I'm getting conflicting feeback from Indium. This says its not a problem... http://indium.custhelp.com/cgi-bin/indium.cfg/php/enduser/std_adp.php?p_sid=kTDKGClg&p_lva=&p_faqid=355&p_created=1014734692&p_sp=cF9ncmlkc29

Solder Balls in Boards

Electronics Forum | Mon Jun 21 11:14:25 EDT 2004 | exmaintenanceleader

Dear Kanwaljit Singh, my opinion is following: 1)solderpaste type is ok - usual (alpha-metals has this problem inside the paste paste- holder problem) - what do the operator when production change -clean well the stencil holes!! no visible rest on

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

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