Electronics Forum | Mon Apr 21 08:53:22 EDT 2008 | realchunks
I don't know of any standard, but do know most suppliers will sell you sub-par displays. Inner layer cracking is usually the biggest defect due to handling. We had our supplier in and they showed us what to look for under magnification @400 times.
Electronics Forum | Tue Aug 24 15:11:32 EDT 2010 | sjohnson
We are experiencing a high incidence of what we call "black barrel" (to differentiate from black pad) with multiple contract manufacturers and PCB vendors. The PCBs are ENIG and during wave solder (SACX-0307) multiple thru-hole components are seeing
Electronics Forum | Wed Sep 15 09:49:28 EDT 2004 | pjc
zero- strive for no post wave "touch-up"
Electronics Forum | Wed Sep 15 13:47:35 EDT 2004 | davef
Here one stake in the ground: http://www.thepdfshop.co.uk/ppm/Index.asp
Electronics Forum | Fri Mar 25 14:33:26 EDT 2011 | davef
IPC-7525 Stencil Design Guidelines
Electronics Forum | Wed Sep 15 23:15:55 EDT 2004 | pdeuel
Im with Pete, Zero defects. We have high defect rate for many reasons. No line tech, operators set up and run then when QA reports defects engneers are called. Not to make people mad but our process engneers are lacking practical experance to fix pro
Electronics Forum | Tue Sep 28 08:04:26 EDT 2004 | davef
Grayman: How does a "solder wave optimizer" replace fax paper to indicate flux penetration of PTH?
Electronics Forum | Thu Apr 17 09:57:39 EDT 2008 | bkreiman
Our company is placing an LCD display on boards for a customer and there are questions being raised on the quality level we are getting from our supplier on these LCDs. Does anyone know what an industry-wide quality level for LCD modules should be?
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Wed Dec 28 16:49:26 EST 2022 | emeto
HiP most of the time goes back to the component package itself. If they are on the periphery of the part, it is a result excessive of expansion and contraction from the temperature. If it is in the middle, other contributors come in place.
