Electronics Forum | Wed Nov 13 16:48:19 EST 2013 | spoiltforchoice
I would expect any half decent machine to place 0603 parts slap bang on target to the typical defined accuracy for such parts on most machines of perhaps ~60 microns or better. Self correction during reflow is IMHO much less pronounced with lead-free
Electronics Forum | Wed Oct 23 13:01:11 EDT 2019 | compit
I have a single-view camera on a Topaz-X machine. When I define a connector type element - it displays messages like in attached files. If I change the type to IC - no problem. There is also no problem when "learning&quot
Electronics Forum | Tue Nov 25 22:25:24 EST 2003 | davef
We had a similar problem on the high impedance front end of a MOSFET amplifier a few years ago. If your situation is like ours, the issue is not what a consensus specification [like J-STD-001] defines as an upper limit, but what your product is defi
Electronics Forum | Thu Mar 25 19:07:22 EDT 2021 | llawrence
That is all a lot to take in, but thank you all for the recommendations. From what I understand, I'm going to start by ordering a new polished 0.1mm stencil with size reduced apertures and seeing if reduced paste deposit will help. As for the sten
Electronics Forum | Thu Jun 06 02:27:43 EDT 2002 | ianchan
Hi mates, does anyone know if there is a industrial standard spec for environment(deg-C, RH%) operational use of Paste Printer machines? If there is no study to define a deg-C, RH% specs for immediate environemnt operation use of a paste printer ma
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Thu Jan 12 10:05:13 EST 2006 | davef
There's a lots comparisons like this on the web. Here's one: Westwood Associates said on 8/12/2003: ||HASL||OSP||ENIG||Pd||Tin||Silver Flat||no||yes||yes||yes||yes||yes Solderjoint||Cu-Sn||Cu-Sn||Ni-Sn||Ni-Sn||Cu-Sn||Cu-Sn Contact||E-test, ICT||no|
Electronics Forum | Wed Aug 07 08:49:35 EDT 2002 | davef
What do you want to be certified? So, do you have a specification control drawing for each component that defines your expected performance capabilities for use by your buyer in acquiring these parts? If there is a reason to fabricate parts to your
Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Wed Aug 27 15:50:11 EDT 2014 | smtdoug
If at all possible, you definately want solder mask defined pads. Without it, you will struggle with solder bridging. This is especially important if you have a larger size board.
