Electronics Forum | Mon Nov 13 09:22:10 EST 2006 | aj
Hi all, Should we need to order the Higher TG to run boards safely thru a RoHS Process (reflow only)? We had an issue with the previous batch delaminating and were advised by supplier that we should have stated the higher TG rating even though the p
Electronics Forum | Wed Aug 01 18:14:13 EDT 2007 | swag
We had the same trouble. We baked our boards out but the delamination continued very random. One board would be fine and the next was a nasty explosion of delam. Switched material - no problems since. I never found out the technical reason behind
Electronics Forum | Thu Nov 20 13:00:36 EST 2008 | jameskelch
Calling out materials by name locks you into laminates by brand. If these are typically phenolic materials it can lead to moisture absorption, less mechanical strength and more prone to delamination during assembly. It is more effective to refer
Electronics Forum | Mon Dec 08 11:46:09 EST 2008 | mleber
We are experiencing delamination / measling on card we have been running for years. No change in process. Same equipment, profiles etc. The weird thing is we are experiencing it on pwbs from different mfgs and different processes (reflow, wave, selec
Electronics Forum | Mon Jun 13 09:25:58 EDT 2011 | milroy
Hi I have seen some of our multilayer PCBs are having delamination issues even after baking them in the ovens. Does anybody faced this issue before? The problem occured after reflow process and wave solder process as well. The temp profiles are well
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Mon May 14 22:24:11 EDT 2001 | davef
The time over liquidous of the profile seems short. But then again, who knows? Based on what you told us, I'm guessing at a board fabrication problem, either measling or delamination. Probably the former, rather than the latter. [Now, we remember
Electronics Forum | Tue Apr 27 13:58:15 EDT 1999 | Scott McKee
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
Electronics Forum | Tue Apr 27 17:22:40 EDT 1999 | Dave F
| Board Experts | | I am fighting with a board house about a delamination problem.. First the facts | 1) 10 layer board .063 thick HASL Finish Aprox 16 in x 17 in. | 2) 150 Boards with this part number built with the same reflow oven settings (2
Electronics Forum | Mon Nov 06 12:19:25 EST 2000 | Tom Gervascio
I ma trying to get some information on possible causes and screening tests for PCB delamination. Is the main cause moisture absorption of PCB material or entrapped chemicals and or air in innerlayers that expand when expsoed to subsequent reflow and
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