Electronics Forum: delamination and solder and mask (Page 8 of 9)

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Contamination/process issues of SMT and wave soldered pcb's

Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef

With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Aug 18 15:04:25 EDT 2014 | rgduval

Off hand, I can't recall a "formula" for how long boards could sit in a specific RH environment. I've done a couple of quick Google searches, and can find a bunch of information on the dispersion rate of moisture in various PCB materials, but, nothi

Wave Solder Balls, VOC-Free Flux, and Glossy Mask

Electronics Forum | Tue Oct 03 18:41:16 EDT 2006 | C.K. Flip

With recent implementation of VOC-Free flux in our shop, we've experienced little solder fines/balls on the above combo of VOC-Free, Water Based, and glossy to semi-glossy mask finish on PCB's. The solder balls show up on close conductor spacings, ~

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Thu Mar 25 20:50:50 EDT 2021 | stephendo

A couple more things. The PCB. What size are the pads? One time a board shop had difficulty putting masking between the pads of a QFP and the pads suffered as a result. When I told them they didn't have to have masking between the pads, the pads w

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 09:47:41 EDT 1999 | Peter Brant

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. WIth regards to this question, and scott's follow up, I have used the "epoxy me

Bar Coding - auto print and apply solutions

Electronics Forum | Tue Mar 20 15:59:15 EDT 2007 | blnorman

We use preprinted labels and laser coding. For PCB we laser mark with CO2 (NdYAG for the aluminum heat spreaders). We either have an epoxy legend to burn out or we burn the solder mask to expose the copper ground plane underneath. Laser is a much

SOT-223 Flux trapped under part and lifting off pads

Electronics Forum | Thu Sep 30 11:30:46 EDT 2010 | babe7362000

Take a few parts from the reel and look close at > the parts to make sure the bottom surface of the > leads is below the bottom surface of the body. Yes I did that and they are below the body. I found the problem I think. The solder mask is abo

2 questions: via tenting and annular ring terminology.

Electronics Forum | Tue Jul 06 19:38:01 EDT 1999 | John

Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. Q #2) When speaking of annular rings, I have always thought of them as minimums. Su

Re: 2 questions: via tenting and annular ring terminology.

Electronics Forum | Wed Jul 07 10:25:13 EDT 1999 | John Thorup

| | Q #1) Is it more reliable to have the mask tent over the vias or risk getting vias half filled with solder? These are vias with an .020" hole and .040" or .050" pad. | | John, | It depends......mainly on the via size. Tenting works on smaller vi


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