Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Mon Mar 27 20:59:41 EST 2000 | Dave F
Garo: Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temporary basis. There is no standard, IPC or otherwise, on voids--nor should there be. See also J-STD-013,
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Sat Jul 31 13:35:14 EDT 1999 | Miguel Mariscal
| Has anyone done the research on BGA pad size? suppose I have a 0.030" diameter pad as recommended pad size from the spec, what will the minimum pad size allowed? We are laying out a high density board. | If you know what component your'e going to u
Electronics Forum | Fri May 17 11:10:25 EDT 2002 | wister
Is there any software to design the stencil openings? It may be including automatic modify the aperture,monitoring aspect ratio and area ratio,even let you know the whole vloume of the opening and average ratio?because the stencil design is more impo
Electronics Forum | Wed Jul 03 19:17:54 EDT 2002 | davef
I prefer 'YAUC' [Yet Another Unit Converter] by Marius Miller. YAUC converts between many units - Metric, Imperial and others. It supports 585 units, in 40 categories, including Acceleration, Angle, Area, Current, Density, Energy, Force, Frequency
Electronics Forum | Fri Oct 18 21:31:15 EDT 2002 | caldon
Many times the board may look the same but incases there could be subtle differences that could cause your process to go out of process limit. With boards that look alike you still need to consider: Solder paste (Is key to the reflow profile) compone
Electronics Forum | Fri Mar 14 23:41:11 EST 2003 | MA/NY DDave
Hi Well maybe someone else has better info yet I don't see this fully associated with density of package. As long as the process gives a good Electroless NI, Immersion AU you should be OK. If it doesn't and the process output is marginal as has been
Electronics Forum | Tue Mar 04 00:55:12 EST 2003 | nifhail
In the double sided SMT process assembly, normally the bottom side will be processed first, due to it's lesser density as well as it's lesser heavy components. Apart from worrying about the component falling down, what are the potential problems that
Electronics Forum | Thu Feb 17 15:54:35 EST 2005 | JB
Most of our profiles are a variation of one another. Depending on the thicknes and density of the PCB, we make the nescessary changes and then we profile it, to make sure it meets our specs. Check this out: http://www.smtnet.com//forums/index.cfm?