Electronics Forum | Tue Dec 11 15:04:42 EST 2001 | davef
Sure those products and other competitors listed in the fine SMTnet Archives provide a uniform solder deposit, how do you suggest that Russ provide the proper amount of flux and heat to properly form his solder connection?
Electronics Forum | Thu Feb 28 11:37:28 EST 2002 | Nightbull
I would like to know if there are any IPC standards or anything remotely referring to having a Solder Paste Deposition tester in house to check the printing process. I have an interesting situation. Any help would be appreciated.
Electronics Forum | Wed Apr 17 22:43:54 EDT 2002 | ianchan
what process is that? can kindly describe? is it that technology where bricks of solder are "ready made" deposit onto PCB pads thus eliminating the need to solder paste print/dispense by machine?
Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
Electronics Forum | Thu Jun 20 03:15:22 EDT 2002 | Paul
I've seen a problem recently where there was 2 deposits of Nickle then Gold, The problem is the Nickle will not adhere to Nickle, see if you can scrape the pad away with a scalpel.
Electronics Forum | Thu Jul 25 06:14:21 EDT 2002 | matherat
Defect rate is a variable that is hard to evaluate from company to company. Look into solid solder deposit which will eliminate smd scrap/defects all together, no matter who assembles it. http://www.sipad.com mk
Electronics Forum | Thu Aug 01 06:09:01 EDT 2002 | mzaboogie
Hi Pete, The boards are HASL. The frequency is random. The solder balls are randomly deposited along the path of the select wave, not always along the component bodies. We are very careful regarding handling. There could have been contamination on s
Electronics Forum | Fri Aug 16 06:39:12 EDT 2002 | Matt Kehoe
SIPAD solid solder deposit and glue dots is an excellent solution. www.sipad.com Matt Kehoe SIPAD Systems Inc
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Wed Sep 18 20:55:33 EDT 2002 | scottefiske
I'm with you dave...please provide specifics as to defect condition... Are you getting good wetting to both land and lead? Is there any repeatability to lead/location/device? Do you have paste inspection capabilites to verify deposition? Is it a Pala