Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta
Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,
Electronics Forum | Mon Sep 27 04:08:25 EDT 1999 | Earl Moon
| | | I am in the process of picking a new resistor network for one of our new board. Since we are new to SMT i would like to get some opinions on networks. Currently we use one molded gullwing type network on our boards with no problems. Other than
Electronics Forum | Fri Jun 25 16:32:45 EDT 1999 | MMurphy
| | | hello, | | | | | | has anyone tried dispensing solder paste in thru holes instead of waving or hand soldering. if so how did it work out for you. | | | thanks for the input | | | | | | wayne | | | | | | | | | | | We have tried this mainly
Electronics Forum | Tue Jan 12 21:42:33 EST 1999 | Jon Medernach
What's important in stencil printing (which differs from screen printing) is providing a consistant volume of paste at each interconnect. The process window varies in proportion to the pitch. More than 60% of all defects are related to solder depos
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
Electronics Forum | Tue Aug 04 12:15:33 EDT 1998 | Steve Gregory
| | | | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | | Also, has an
Electronics Forum | Sat May 16 19:31:27 EDT 1998 | Graham Naisbitt
Gentlemen, Please consider that ionic testing is designed only for detecting ionic contaminants. Yes there are instances of non-ionic contaminants that cause premature circuit failure. However, more importantly the prevailing specs are less than adeq
Electronics Forum | Tue Sep 10 12:17:42 EDT 2002 | dragonslayr
Genny - one more reply from the chorus. Do consider why Contract Manufacturing came into vogue in the first place. It allows OEMS the opportunity to focus on what they do best, design and marketing/sales. It also reduces the overall costs of doing bu
