Electronics Forum | Wed Jan 05 11:01:37 EST 2000 | Ron Lahat
I have in design a 400mm x 400mm pcb 3.0 mm thick heavily populated with BGAs 50 mil pitch and want to run a double sided reflow process with overlapping BGAs (CS/PS) 1. can I avoid a selective jig for PS BGAs?(weight calculation ?) 2. Is it possibl
Electronics Forum | Thu Nov 18 09:34:58 EST 1999 | Wolfgang Busko
Hi Will, it�s possible to use second reflow for second side components without glueing or use of different alloy solders. Although the first soldered joints become liquid during the second pass the parts will not fall off as long as their weight does
Electronics Forum | Fri Oct 26 11:37:27 EDT 2001 | Dave G
You could start by putting together a matrix of P/N's vs product. This will tell you which parts are common with most of your jobs. These would then become part of a fixed feeder setup that would stay on the machine. (These will probably be mostly R'
Electronics Forum | Fri Sep 06 13:45:02 EDT 2002 | Cris Campos
To Scrap or not to Scrap? We have the answer to your problem. Visit http://www.circuit-techs.com for more information regarding Printed Circuit Board Repair, Rework & Modification in accordance to IPC 7711 & 7721.
Electronics Forum | Thu Mar 01 11:47:20 EST 2007 | Wagoner
Run the lead free BGA side first. Then run the tin lead side second. We do this on some boards so that we don't overheat the components on the second side. There is no reason that the lead free solder needs to reflow on the second pass.
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