Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Fri Mar 02 09:08:25 EST 2007 | samir
There is a formula that determines whether a component will fall off during a 2nd reflow. It takes into account the grams (weight) of the component and the total surface area of the solder joints. I don't know this off the top of my head, but it's
Electronics Forum | Thu Jul 15 17:53:34 EDT 1999 | Boca
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Tue Sep 22 13:14:27 EDT 1998 | Chrys
| We are getting into a lot of double sided boards offlate. Our customer is loading a lot of RNETS, Diodes ( MINLS, SOT23s and other 2 leaded diodes ). We are processing it through a traditional glue process and wave soldering the SMT parts along wit
Electronics Forum | Thu Mar 18 18:07:21 EDT 2010 | grahamcooper22
Hi, First check what the Moisture Sensitivity Level of the LEDS is....you may need to ask the LED manufacturer. Once you've established it is moisture sensitive then follow latest version of IPC JEDEC 33 spec. for storage of them and drying them if t
Electronics Forum | Fri Mar 19 03:13:35 EDT 2010 | mun4o
Hi, First check what the Moisture Sensitivity > Level of the LEDS is....you may need to ask the > LED manufacturer. Once you've established it is > moisture sensitive then follow latest version of > IPC JEDEC 33 spec. for storage of them and dryi
Electronics Forum | Thu Jun 13 08:32:24 EDT 2013 | rway
Have you verified the measurements on the bench with an LCR meter? Chances are you are experiencing aging with these ceramic caps. We have similar issues with X5R and X7R caps. You will see the effects of aging with returns from the field as well
Electronics Forum | Thu Jun 23 08:58:00 EDT 2005 | Irene Taylor
We are defining a new assembly process for a double sided card that has 26 BGAs on the top side and 14 BGAs on the bottom side. We currently have one double sided BGA board with one BGA per side and have to epoxy one BGA (35mm X 35mm - 352 ball count
Electronics Forum | Thu Apr 11 11:32:23 EDT 2002 | barryg
Hello everyone. We are interested in doing double sided surface mount. What methods are there for doing this. I know you can wave solder some smt components, but what are the limitations. Is there a method of doing this that uses 2 different solder p
