Electronics Forum | Thu Aug 12 04:52:04 EDT 1999 | Omat Marasigan
Hello everyone, I would like to know more about the so called FACETED or "Mirror ball" surface apperance. Its cause and how to eliminate / corrective actions for it. pls. help... thanks and best regargs, ...Omat
Electronics Forum | Mon Aug 09 10:10:29 EDT 1999 | Gian.D
hello to everybody, we have a really satisfactory no clean process, both smt/reflow and wave soldering, but we get troubles with defects rework; does anybody know how to eliminate flux residues or how not to produce them during rework operations? Th
Electronics Forum | Thu May 27 13:49:01 EDT 1999 | Greg Curler
One of our board fab houses is asking (again) to eliminate the reference designators and polarity markings from boards. This isn't feasible for thru-hole, but what is the industry trend on surface mount assemblies?
Electronics Forum | Wed Apr 28 13:53:00 EDT 1999 | Tony Arteaga
Anyone using hot air nife for wave soldering process. Does it work? Does it really eliminate solder bridging and does it create any other problems? any feed back will be much appriciated. Thanks Tony A
Electronics Forum | Mon Mar 15 10:43:06 EST 1999 | grevald
After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids
Electronics Forum | Tue Feb 09 10:17:43 EST 1999 | Mario Guel
Hi. I'm trying to looking for a manner to enlagre the solder tip life. I have heard about some chemicals substances that help both avoid or eliminate oxidation on tips. Anybody can suggest me some of those products Thanks in advance Mario Guel CMC Me
Electronics Forum | Mon Jan 11 10:29:07 EST 1999 | Tom OConnor
I know that static concerns are very important in your work. Are static concerns eliminated by the antic-static devices you wear or which are in your environment, or do the hand tools you use, such as picks, tweezers and brushes, need to be anti-stat
Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Apr 17 22:43:54 EDT 2002 | ianchan
what process is that? can kindly describe? is it that technology where bricks of solder are "ready made" deposit onto PCB pads thus eliminating the need to solder paste print/dispense by machine?
Electronics Forum | Mon Apr 29 03:01:53 EDT 2002 | Bob Willis
Had a similar problem recently where there were scatered balls and voids in joints and on the surface of the joints. The paste was dispenced from a cartridge with no kneeding or mixing before printing. The result was spitting and voids. Mixed the pa