Industry News | 2003-08-27 10:58:00.0
Lead free solders and embedded passives headline professional development schedule at the 2003 IPC Annual Meeting
Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2003-04-28 07:17:28.0
The conference took place March 22-27 in Long Beach, Calif., in conjunction with IPC Printed Circuits Expo� 2003
Industry News | 2010-08-02 13:24:44.0
SMTA China will present the SMTA China South Conference, Certified SMT Engineer Course, SMTA China’s Fifth Anniversary Breakfast Reception and the annual golf tournament during the upcoming NEPCON South China exhibition, scheduled to take place August 31-September 2, 2010 at the Shenzhen Convention and Exhibition Center in Shenzhen, China.
Industry News | 2010-10-07 14:26:23.0
Yielding to growing concerns regarding the EU Parliament’s proposal to list thirty-seven substances for priority assessment under a revised RoHS Directive, the Belgian presidency proposed to abandon inclusion of a list of priority substances. Belgium currently holds the rotating EU Presidency and is responsible for chairing the EU Council.
Industry News | 2010-10-08 14:17:46.0
Congress adjourned last week without taking action on the House version of the Fiscal Year 2011 Department of Defense Appropriations Bill, which sources say contains a provision directing the Department of Defense (DoD) to conduct a defense industrial base assessment of the printed board industry and its supply chain.
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2011-01-12 17:40:04.0
Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.
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