Electronics Forum | Sat Aug 27 09:47:05 EDT 2005 | davef
From the pic, we see blistering, but none so close to via that we'd attribute the blistering to via, via plugging, or anything of the sort. When we see blisters like this, we think of a surface contaminant being present on the boards at the time of
Electronics Forum | Wed Feb 21 08:06:23 EST 2007 | davef
The cause could be a lot of different things. As long as you didn't use excessive reflow temperatures, we'd guess that: * Solder mask blister: Your board fabricator should be able to demonstrate through TMA [or equivalent] analysis that the mask wa
Electronics Forum | Fri Apr 06 18:17:49 EDT 2007 | davef
Mika: Based on what we hear you saying, we're not so sure we have a problem with the board layout [1:1 between board and interposer pads, non-solder mask defines pads], but with the flawed execution of the layout. If your board fabricator decides to
Electronics Forum | Mon Mar 10 20:14:20 EDT 2008 | davef
We'd be unhappy with features that are not in copper that is at the same level as the component pads, because of difficulties the fabricator would have in maintaining registration between the copper pads and the ink used for the features not in coppe
Electronics Forum | Tue Dec 09 10:04:36 EST 2008 | lazzara55
SMT-ypw: Does PWB supplier start to implement PWB drying packaging? B3: YES! The fabrication of the PCB involves a series of wet processing that requires counter-measures to remove moisure. While some of the PCB processes also include bake cycles th
Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman
If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere
Electronics Forum | Tue Jan 20 17:51:24 EST 2009 | davef
We'd guess that since your board fabricator could not remove this stuff with it's HAL-leaded process, you're unlikely to remove it with your soldering process that is likely to be pansy-ass compared to your fabricator HAL process. Hey, why not run a
Electronics Forum | Tue Jan 26 10:26:54 EST 2010 | bandjwet
Dear SMTNetters: Based on your experiences is it really necessary to have today's YAG laser-fabricated stencils electropolished? I undertsand that this "requirement" is a carry-over from the days of CO2-fabricated lasers where the hole wall quality
Electronics Forum | Fri Oct 14 12:03:32 EDT 2011 | fborja3
I want to start an assembly that may require use of SMT machines such as SMT assembly, bond wire, Xray and PCB fabricator machines. I apologize I am not to savvy with the technical names such as the above but I just want something not to costly or e
Electronics Forum | Mon Jun 18 04:21:22 EDT 2012 | brettrenishaw
Measured the pot temprature independantly from the software (268C/514F from moving wave). We are using Dross Inhibiter Tin/P Regenerator from BLT. Monthly sample checks are carried out on the solder bath and are all within limits. It will be hard to
