Electronics Forum: factors (Page 8 of 96)

Flip chip or wire bond?

Electronics Forum | Mon May 10 23:10:40 EDT 2004 | yvonne heng

Hi Jon, well,i think that wirebond is still the best option at the moment since it is more flexible unless size is one of the important factor.

Temp/Humidity Recorders Coverage

Electronics Forum | Tue Jan 14 16:26:41 EST 2003 | Dave F

Let me make it simple than! one controller should be enough for a 400 sq ft room as a good rule of thumb. Although there are many factors that can affect this rule of thumb so read your graphs and take the approciate action. Dave

BGA PCB Pad size

Electronics Forum | Sun Jan 26 21:09:32 EST 2003 | Grant Petty

Hi, Ok, thanks for the info, and I had not considered that factor. Is this an issue related to the reflow temperature change in the oven, or a temperature change in normal product use issue? I will check out the standard, and do you know where it's

QFP Coplanarity & Alloy 42

Electronics Forum | Tue Sep 30 20:05:34 EDT 2003 | afm

Does alloy 42 lead frame on a QFP100 make lack of coplanarity (let's say 2 mils), a critical factor to have non-wetted leads? Lead coating is tin lead 90/10. afm

.5mm BGA

Electronics Forum | Fri Feb 20 13:55:32 EST 2004 | black5629

That will depend on so many factors: solder type / flux type sphericity of balls in paste stencil type (laser chem etch, electro form etc.) print paramaters I will tell you that it can be done.

mil to mm conversion chart

Electronics Forum | Tue May 25 22:01:55 EDT 2004 | davef

Use "40" as a down and dirty conversion factor, where: * Multipling X mm by 40 gets Y thou * Dividing Y thou by 40 gets X mm

Volume of paste deposited with respect to board thickness

Electronics Forum | Tue Jun 01 10:15:29 EDT 2004 | davef

We agree with John about his comments on the controlable factors relating to your printer, but we'd add that paste formulation and mesh are also contributors to nice looking bricks.

Lead free solder paste selection

Electronics Forum | Fri Jul 02 17:05:26 EDT 2004 | blnorman

Depends on your specific application. Can you handle lower reflow temps? Can your parts handle higher reflow temps? What environment will your assembled product have to endure? Lot of different factors come in to play when choosing the right allo

Acceptable level of defects for Wave Soldering

Electronics Forum | Wed Sep 15 06:53:48 EDT 2004 | John

Hi Everybody, Can enybody tell me what is acceptable level of defects for Wave soldering?I know that it's depends of many factors,but I want to benchmark my process. Thank you

BGA Soldering

Electronics Forum | Mon Nov 01 15:35:25 EST 2004 | Ken

Agreed. You will find different part manufacturers have different coplanarity specs. In fact I have on supplier that calls out 7 mil max coplanarity. Then factor in board bow and twist and it becomes a real joy.


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