Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Tue Dec 01 07:24:44 EST 1998 | Earl Moon
| Hi folks , | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspection
Electronics Forum | Tue Dec 01 07:54:49 EST 1998 | kallol chakraborty
| | Hi folks , | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our inspec
Electronics Forum | Tue Dec 01 09:02:18 EST 1998 | Earl Moon
| | | Hi folks , | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Our in
Electronics Forum | Fri Dec 04 20:26:34 EST 1998 | kallol Chakraborty
| | | | Hi folks , | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most. Ou
Electronics Forum | Fri Dec 04 20:37:45 EST 1998 | kallol chakraborty
| | | | | Hi folks , | | | | | Lately we are seeing a lot of rawcards with black spots on the pads - most of them have Au finish(immersion gold) . We did a lot of inspecton after wave solder and found that only (fine pitch) QFP are affected the most
Electronics Forum | Tue Nov 29 18:06:53 EST 2005 | OverTheHill
ENIG, AG, SN, OSP, DIG, Flash Gold or others ???? Let's here your comments, frustrations, success stories, etc.
Electronics Forum | Fri Oct 20 05:55:16 EDT 2006 | Eric Chen
40% in wetting problem. I would like to know any specific reflow profile in order to acheive good wetting at this type of lead. Besides, any specific paste e.g. halide containing paste required
Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam
Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..
Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol
Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type
