Electronics Forum: first yields (Page 8 of 14)

AOI vs. XRay

Electronics Forum | Tue May 08 13:39:27 EDT 2001 | genny

Thank you for your response. I have been told that x-ray strength is finding solder volume and pattern root cause defects, and will catch a high % of them - opens, shorts, insufficient solder, and missing components(shape of solder on pad w/o lead i

Process Capability Studies

Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis

Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma

BGA solder failure rate

Electronics Forum | Thu Oct 28 13:36:14 EDT 1999 | Bart Smith

I am a design engineer and have a circuit board design with a 292 pin BGA on it. The board manufacturer is experiencing a failure rate of about 2.8% on the BGA device due to soldering problems. This is my first experience with BGA. How does the 2.

A Meaty one for you clever guys in production

Electronics Forum | Mon May 16 12:45:09 EDT 2005 | timekey

John- Although we don't produce "production simulation" software what we do produce will help you achieve better yields and throughput. Our software monitors the placement accuracy on Fuji placement equipment. "Optimization" and "production simula

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May

Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on

A.O.I recommendation

Electronics Forum | Thu May 26 06:59:06 EDT 2005 | CLampron

Good Morning, We have several Mirtec table top machines. We bought the first one when it was under the Samsung name. We had the advantage of doing a side by side comparison with several other systems. The Mirtec was the leader in performance. Since

Re: Wave Soldering Active Components

Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis

| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto

AOI systems vs. X-ray

Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny

We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som

Re: Frameless Stencils

Electronics Forum | Fri Jan 14 10:11:45 EST 2000 | John Thorup

I'll have to go along with Wolfgang as having a good experiance with frameless. We have been using a system from IIT in California for about a year. I was sceptical at first because of this system's X only tensioning but it does work. We use mostl

Re: Cleaning Stencils

Electronics Forum | Wed May 26 14:01:18 EDT 1999 | Bill Schreiber

Dear Ricardo, We have a number of published articles on our web site. One of them is titled "Improving Screen Printing Yields" by Richard Clouthier of AMTX stencils (now Photo Stencil). This article appeared in EP&P magizine and also Asian Electron


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