Electronics Forum: flats (Page 8 of 80)

Way to solve PCB warpage

Electronics Forum | Sun Dec 19 23:22:11 EST 2010 | Jacki

Hi Rem Woo, ur board is such long one,7'. Our PCB is only 2' long but 3.5kg weight b4 solder. We use wave machine to solder it and PCB was sit on the pallet. all PCB side lengths are pressed by clamps. PCB was flat just after wave, however there was

Ficiduals, Best Practice

Electronics Forum | Tue Sep 13 12:00:57 EDT 2011 | swag

Flex circuits are assemblies that can be bent or twisted into shapes after assembly (flexible). When heald in panels for SMT assembly, it's difficult to get repeated x/y offsets so you need to consider fiducal placement in your design for placment m

Solder Skips and Shorts on Lambda Wave, Omega Upgrade?

Electronics Forum | Mon Aug 13 09:49:35 EDT 2012 | rjlatz

I just got back from a visit to our PCBA manufacturer. We have good flowthrough on the PTH, but solder skips and bridges on the SMT SO IC's. We have correct orientation and robber pads, but the results are still the same. I noticed the wave shape is

SMT solder Covering component surface

Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost

We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo

Re: BGA and PCB finishing

Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker

Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.

Vertec probes for wafers testing

Electronics Forum | Fri Nov 10 12:22:12 EST 2000 | casi

I'm interested in probes for wafer testing made in verted. I need to tested wafers with pad with flat gold bumps ( 17um ) with pitch = 70um. I'm also interested in every web site related on gold bumps testing. Thanks a lot !!! Casi

Re: OSP surface finish.

Electronics Forum | Thu May 25 21:50:27 EDT 2000 | Dave F

Bill: I'd expect better gasketing on a nice flat solder mask surface rather than the edge of the stencil opening mashed down on a irregular shaped hunk of solder attached to a pad. Stop thinking and get printing Dave F

Re: BGA and PCB finishing

Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker

Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.

Re: Weebinjipped

Electronics Forum | Thu Jan 13 13:49:32 EST 2000 | Dave F

JAX: Thanks bud, I've been known to hurt myself walking across a flat floor. Hell, I hurt myself in bed one time, er wazat someone hurt me in bed on time??? Can't remember. Dave

Re: Via in the middle of a pad

Electronics Forum | Wed Jan 05 09:44:45 EST 2000 | Millerin Claude

Some PCB's manufacturers are now able to fill the hole and then re-metallized the pattern in order to obtain a final soldering surface perfectly flat but with an electrical connection under. This of course increase the price of the pcb but avoid any


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