Electronics Forum: flex cicruit reflow (Page 8 of 12)

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

Voids problem in Lead free process

Electronics Forum | Thu Oct 05 10:37:10 EDT 2006 | David

Hello all, We have problem with voids in one of our product. We are soldering IC (package SO8) with under the components grounding connection. The ground pad for this component has 3 via holes (before producing we have to cover this 3 holes from b

Ways to control SMT gap to PCB

Electronics Forum | Thu Dec 07 19:20:28 EST 2006 | ganoi

Most likely there is movement during reflow. How about conduction oven over convection oven for reflow? This is a small PCB with the LED sitting on a Flex-Rigid extension from the PCB. I was thinking if the stencil aperature for the LED was to be cu

SMT on Flexible circuits

Electronics Forum | Fri Feb 16 06:47:38 EST 2007 | CL

vshan, We were using pallets (delmat with cavities for the flex) We put stips of double sided Kapton tape in the critical areas. The tape held up to the heat and kept the circuit flat for the QFP's and BGA's. We based our assembly process for this c

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad

One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef

Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can

Re: solder balling

Electronics Forum | Thu Aug 10 03:30:42 EDT 2000 | JohnW

Ramon, Solder ball' are a bitch aint they?, identifying the right location to fix em is a bigger one. As you and the rest of teh guy's have said yes you'll need to look at your stenil..but maybe your stencil is good so you'll need to look else where

Re: Wave Soldering With BGA's

Electronics Forum | Tue Sep 14 09:13:34 EDT 1999 | Chris McDonald

Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? Hi Chris, Why don't you process a double side reflow and use selective wave fixture for wave process. T

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:51 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o

Unwetting leads of Palladium Plated Pins

Electronics Forum | Mon Mar 01 11:03:22 EST 1999 | Dennis Xiong

Hello! SMT professionals, I do not know if anyone posted this question before. Last week, I reflowed our newly designed thin Rigid-Flex pcb with 0.040" thickness. I found all of pins of a TQFP48 ic did not get wetted. I could see on the heel side o


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