Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Thu Feb 06 14:27:18 EST 2003 | MA/NY DDave
Hi You already have some good answers. Let me add just a little of what I know. You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology. Checking with e
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Sun Feb 22 02:23:25 EST 1998 | Jon Gruett
Chang, I recommend that you stop by the Siemens booth at the NEPCON West show and see the F4 and F5 machines. I think you will be pleaseantly surprised by what you see. Take some time and really research the next generation of machines that are her
Electronics Forum | Mon Apr 01 23:16:44 EST 2002 | dwoon
Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip assembly. It eliminates the need for a separate underfill operation. Does anyone has experience in actual production run? What is the possible effect for
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Wed Aug 03 05:16:11 EDT 2005 | kokjianling
hi all, i want to find out the differences of the manufacturing processes between - PBGA - EBGA - CTBGA - Themally Enhanced PBGA(TEPBGA) - High Performance BGA - MCM-PBGA - Chip array - chip array (CASON) - Super FlipChip - flip Chip CSP (FCCSP) - St
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Wed Sep 23 08:19:52 EDT 2009 | rgduval
Check to see if there's a loose cable, or something, that's randomly setting off the light curtain. We occasionally have that problem with some of our flex or 12/16 mags in our TP9, where the tape take up clip is loose (nothing in that feeder) and i
