Electronics Forum | Fri Oct 16 21:33:51 EDT 1998 | Scott
| I do not think that the Mydata can pick from wafer or has the accuracy required (12 micron)! Am I missing something? I don't have personnal experience with flip chip but the next time you're at Nepcon ask Mydata to show you their demo board with
Electronics Forum | Mon Sep 28 12:43:48 EDT 1998 | Manish Ranjan
Hi Everybody My company is looking to buy some precision measurement systems to measure the height of flip chip bumps (nominal height of 100 microns). We are looking for a resolution of about 2 - 4 microns. Any help would be appreciated. Thanks Man
Electronics Forum | Mon Dec 29 09:50:58 EST 1997 | Bob Willis
I need to find different sources for tin lead bumped die for demonstrations. I require 3000 parts can any one supply details of suppliers Tel, Fax and Email ?
Electronics Forum | Mon Aug 27 01:48:06 EDT 2001 | apg
Dear Hussman We use automatic machines on mounting PHILIPS and though quality and velocity of their mounting are very good, the girls occupied with quality control can not on 100 % to check quality of the soldering FLIP CHIP and BGA!!! Pavel
Electronics Forum | Wed Aug 07 22:20:59 EDT 2002 | davef
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional Publishing; ISBN: 0071351418; 1st edition (February 8, 2000)
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Mon Nov 25 16:10:27 EST 2002 | btaylor
I have run the 4Cs for over 8 years it has been a good little machine. We use it for placing 10 mil pitch flip chips. I buy the yearly insurance through Tyco every year.
Electronics Forum | Mon May 10 23:10:40 EDT 2004 | yvonne heng
Hi Jon, well,i think that wirebond is still the best option at the moment since it is more flexible unless size is one of the important factor.
Electronics Forum | Wed Jan 08 03:27:18 EST 2003 | MA/NY DDave
Hi Another add, This depends on your application environment. If you have levels of shock and vibration or high thermals underfill is needed. YiE, MA/NY DDave
Electronics Forum | Sat Mar 29 07:07:01 EST 2003 | mk
http://www.sipad.com/Motorola/MotorolaFlipChip.htm Check out this link. Sounds similar. mk
