Electronics Forum | Thu Mar 09 16:56:19 EST 2000 | Dave F
Ashok: If I was to count, I'd guess there was more than 4 subquestions. Hey, but who's countin' anyway? I have answer (s) "on ESD all related to use of wood in a typical PCB Assembly line:" Before pushing-on, it is only "a typical PCB Assembly li
Electronics Forum | Thu Nov 07 12:51:09 EST 2002 | slthomas
This is embarassing. I've used ipa (actually "70/30 rubbing" alcohol) to clean these for a better view (this is a no-clean), and found the above described anomaly to be intact. So, I assumed it was something in the solder itself. Well, today I us
Electronics Forum | Tue Apr 13 11:41:18 EDT 2021 | jeremy_leaf
I have a SAC305 preform with which I am attempting to bond a gold coated component to an ENIG coated PCB pad. I've specified 2 microinches of gold for the ENIG. It worked previously but now with a new batch of boards, I am having an issue where the p
Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt
Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go
Electronics Forum | Wed Feb 11 11:53:42 EST 2004 | Maryann
Our company strictly does selective conformal coating applications for the customer. We will quite often see one side looks great, and the other side doesn't. We often see dewetting around holes, and have found this can be a possible flux build up. A
Electronics Forum | Fri Jul 09 06:40:16 EDT 2004 | Chris Lampron
WA Engineer, Good Morning, Your cleaning system requirements will depend on your chemistry use in production. Are you using RMA or OA flux? This will impact the requirements of the cleaning system. OA will allow you to use a DI water cleaner. If you
Electronics Forum | Thu Aug 25 12:34:48 EDT 2011 | rnkamal
Ryan, Another option to look at would be ultrasonic cleaning if your boards/process would allow it. Automated multi-tank models with wash, rinse and dry capability are available for larger throughput. Typically both wash and rinse tanks have ultra
Electronics Forum | Sat Jan 19 02:25:37 EST 2002 | ianchan
Hi, Have a board run, using 63/37 Water Souble (WS) process. during the reflow setup time, we had unsolder issues on a leadless bump chip carrier (BCC) IC level package. To rectify the unsolder rejects, we adjusted the reflow time from 25-55sec into
Electronics Forum | Tue Oct 13 17:30:09 EDT 1998 | Upinder Singh
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
Electronics Forum | Tue Oct 13 22:22:14 EDT 1998 | mike
| All Y'll | | How do you clean components that must be added to an assembled board after water wash? | | BACKGROUND | | Our basic process goes like this: | | 1 Print paste with OA flux, place, reflow, wash | 2 Repeat 1 | 3 Insert PTH, OA flux
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