Electronics Forum | Sat Jun 24 07:49:58 EDT 2017 | ranap121212
@Capse, No but the machine has such a construction, I can not this change
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied
Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run
Electronics Forum | Mon Apr 08 14:16:29 EDT 2019 | sever_83
We've never heard of seen of such a thing either. We tried a clean sample board and applied con coat. Same process through out and we saw nothing. After speaking with the original operators who was curing the boards he had left the boards much longer
Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning
I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!
Electronics Forum | Mon Jul 15 17:35:42 EDT 2002 | davef
Micro BGA � (�BGA�). A Tessera brand name for a fine [0.5 mm and 0.75 mm solder ball] pitch BGA.
Electronics Forum | Wed Apr 04 18:27:53 EDT 2007 | Guest
Most CSPs are BGAs. Some are sent without bumps or balls. Thjos eneed to be bumped prior to processing for best results
