Electronics Forum | Thu Apr 15 20:55:36 EDT 2004 | Ken
Try: Tungsten, tungsten carbide, ceramics like boron-nitride or how about pyrex glass? Glass blowers could make "hooks" that connect to a cross bar. I would NOT use aluminum (even if anodized). Try stainless steel 316. 303, 304 do not have enough
Electronics Forum | Mon May 02 14:59:26 EDT 2005 | Linda Woody
Has anyone experienced electrical shorting between adjacent leads of a ceramic hermatic sealed IC? If so, can you share root cause and corrective action? The shorting appears to be in the glass frit seal itself but the failure mechanism is unknown. A
Electronics Forum | Wed Feb 04 09:21:09 EST 2009 | rameshr
Dear Sirs, We are looking for a quality/EHS approved vendor/make/part for safety products - gloves ,glasses for the following applications, 1.SMT Sceen printing Operator. 2.Reflow & Wave Soldering Operator. 3.PCB Cleaning. We would like to get detai
Electronics Forum | Thu Feb 25 22:01:52 EST 1999 | Chris G.
| Read an earlier thread about using glass slugs to determine placement CPk. Can it actually be done this way? What's the procedure? Be interesting to know 'cause if it's feasible, I'd probably get myself a kit. None of us here are stat's experts
Electronics Forum | Fri Oct 26 17:01:52 EDT 2001 | davef
We process no Teflon boards. Companies, such as Rogers and Taconic, make laminates of Polytetrafluoroethylene [PTFE] er �Teflon�. Common �Teflon� laminates are: * Woven glass / PTFE * Random microfiber glass / PTFE * Ceramic / PTFE * Woven glass /
Electronics Forum | Tue Aug 19 09:23:18 EDT 2003 | caldon
FUJI DUDE- You can purchase a Kit from IPC for verifying machine acceptability. IPC-9850 full kit with Components and boards, and such will set you back around $26,250 (member price). Just the glass board alone will cost you $3,800 (member Price).Thi
Electronics Forum | Mon Mar 27 20:52:22 EST 2000 | Dave F
Marc: In printed circuit board fabrication, fabricators place sheets of prepreg between each pair of glass cores. They stack these layers into books. As they heat and press the books, the sheet melts into an epoxy glue. The thickness of the prepr
Electronics Forum | Tue May 15 14:23:20 EDT 2001 | medernach
Again, I'm not familiar with your material but SMT Adhesives as a collective group are typically hydroscopic. An increase in humidity in your facility will lower the viscosity of certain materials. I don't want to say who's material I've had bad ex
Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon
| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son
Electronics Forum | Wed Nov 28 20:45:03 EST 2001 | dougk
We�ve also had glass diode difficulties- poor adhesion while all other parts are fine (including tall parts). I�ve received some interesting information from Heraeus: It seems the newer glues create a much stronger bond to SMD�s, except glass diodes.
