Electronics Forum | Thu Jun 26 13:24:25 EDT 2008 | realchunks
Do you glue SMT parts on the bottom? If so, use your SMT glue to prevent the short. Just cut a new stencil with 0.020" wide apertures between the pads of the connector (bottom side). We do it all the time.
Electronics Forum | Tue Nov 24 23:55:58 EST 2009 | henry_usa_stencils
You can order the glue stencil at http://www.usastencils.com They can design the opening of the apertures on the stencil in the middle of the caps so you can screen an adhesives through the opening then you will have it right on the center of the cap
Electronics Forum | Thu Jul 06 08:22:04 EDT 2000 | David Chapman
Have you thought about stencils for glue? We stencil all glue boards quite succesfully. No CAD no clogged nozzles, much faster speed aperture designs are fun to work with. Just a thought for an alternative. All the companies mentioned also will advis
Electronics Forum | Thu May 30 09:14:03 EDT 2013 | emeto
I have another idea. Would you check the apertures on the stencil? May be they didn't cut the right size apertures there. If you have smaller aperture you can't get the right amount of paste.
Electronics Forum | Mon Sep 23 02:54:40 EDT 2013 | pradeep_selec
We are using Dpak package & I would like to know which is the best Aperture shape for DPAK, whether is there any problem if the Aperture of Ground pad is made of the same shape & size as the pad & what are the possible issues faced with it. Can I hav
Electronics Forum | Thu Nov 22 10:02:42 EST 2001 | Adam
Guys Has anybody had experiences with plastic glue stencils good or bad ? I also have a couple of questions : 1. Can I use the same aperture design rules for plastic stencils as I do on my metal glue stencils ? 2. How repeatable is a plastic glue st
Electronics Forum | Mon Jul 16 14:48:16 EDT 2001 | mparker
Just received "Circuits Assembly", July 2001 issue. An article regarding solder balls and aperture design, beginning on page 40. This DOE had aperture, reflow profile and no clean pastes (3 types) as attributes. It is advocated that a U-shaped a
Electronics Forum | Wed Aug 25 21:51:13 EDT 1999 | Jason Tomlinson
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Fri Feb 19 03:57:48 EST 1999 | Mark Alder
Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated.
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