Electronics Forum | Tue Jul 18 10:16:49 EDT 2006 | russ
Clean up!, check all conveyors for paste, the printer, oven. If you are splattering in the oven than you need a better profile or better paste, one of the two, maybe both. Hope was helpful Russ
Electronics Forum | Tue Jul 18 11:49:24 EDT 2006 | slthomas
How does your profile fit the paste manufacturer's specs? It sounds like you could be ramping up a little fast and boiling your non-metal constituents.
Electronics Forum | Tue Jul 18 19:20:25 EDT 2006 | sharifudin
Actually we run lead free solder paste and the profile spec very tigh.I can't use capton tape due my product in panel form and save cost.I already verify conveyor,machine and tool free from dust and solder paste but the problem still remain.
Electronics Forum | Tue Sep 30 14:16:49 EDT 2003 | davef
While your waiting for others to respond, search to fine SMTnet Archives on: "solder and gold and finger"
Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat
Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi
Electronics Forum | Tue Apr 17 09:53:57 EDT 2001 | edylc
Hi Thrasher7, We called it wash boards, any misprint from screen printer was at tight control ..and those wash boards when being flow down to the line have an identifier /marker , is a matter on isolation of the problem..... But I still can't think
Electronics Forum | Mon Feb 05 20:43:27 EST 2001 | davef
1 Solder on gold fingers comes from: 1a About 70 % of the time it's caused by poor cleaning of screen printer, staging area (table), conveyor, reflow oven chain or belt, and keeping boards separate from cleaning process 1b After loading paste onto
Electronics Forum | Thu Jul 20 05:04:30 EDT 2006 | bing007
We had a similar problem with gold contact pads. Cleanliness is paramount. If you are using foil tensioning system, wash the foil in a stencil wash before use as the cardboard cassettes may be contaminated. Be very careful when loading into a frame f
Electronics Forum | Sun Jul 26 20:54:40 EDT 1998 | Masdi Muhammad
Hi, Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subjecte
Electronics Forum | Mon Jul 27 17:09:20 EDT 1998 | Rin
| We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the | goldfinger during touch-up or rework and to reduce the contamination we are | planning to imp
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