Electronics Forum | Wed Jan 05 11:11:09 EST 2000 | Dave F
Hey Pat: My responses are: 1. Does anyone have experience with the shelf life on immersion white tin? If so, how long can the boards be stored without adversely affecting solderability. I've heard one year. No, we don�t, because we turn boards fa
Electronics Forum | Fri Dec 08 21:26:44 EST 2006 | billwestiet
You already have some good answers. A chemical isolation zone for RMA is a good idea. If you are looking for new see the two references you have and Austin America. If you are looking for used, see us at http://www.ietechnology.net. We presently
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Fri Jun 23 12:30:24 EDT 2000 | Super K (Evil K)
To answer Gary's question: Gary, you will need a production board, thermal profiler, flux vendors product data sheet on the flux you intend to use, maybe your wave vendor service engineer or wave solder vendor contact (unless you know your wave) and
Electronics Forum | Fri Jun 23 12:32:20 EDT 2000 | Super K (Evil K)
To answer Gary's question: Gary, you will need a production board, thermal profiler, flux vendors product data sheet on the flux you intend to use, maybe your wave vendor service engineer or wave solder vendor contact (unless you know your wave) and
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Sat Jan 14 08:13:14 EST 2006 | gipos Mike
We are doing a lot of CSP-BGA rework with tacky flux from Senju Metal.Their flux is very good.We are buying directly from Japan 529D flux. We have reworked BGA processor plastic sockets of Fujitsu Laptops. What kind of flux you are using? Not all of
Electronics Forum | Thu Jul 22 22:57:14 EDT 1999 | Earl Moon
| Does anyone have any experiences with bga reballing. | When I had reworked failed bga part with new part It was good. | So I tried to reball bga detached but failed . | I guess the cause of fail is thermal shock. | IS IT OK TO REBALL BGA PARTS
