Electronics Forum | Thu Jun 03 09:40:20 EDT 1999 | Ryan Jennens
In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cannot
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L
Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps
Electronics Forum | Fri Nov 22 17:55:39 EST 2002 | robertorre
Your problem may be related to different aspects. 1. Oxidation on landing pads. 2. Either high(To long over liquidous temp) or low temp. 3. Bad solder (not enough vehicles) Run this test: Set a hot plate to 220 degrees C. Make sure you have proper ve
Electronics Forum | Fri Jun 25 17:33:17 EDT 2004 | davef
Nonductile fracture!!! Sounds peculiar. In that case, stop wasting you time messing with the thermal recipe. Either your: * Components have poor solderability [test this by dipping the leads of a couple of the SSOP in your solder pot and then asse
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Tue Jun 28 07:27:32 EDT 2005 | Matt Kehoe
We are experiencing a situation that we would really appreciate some expert opinions on. Our process prints solder paste then reflows it without components. Normally the paste wicks into a very shiny rounded meniscus. Even over gold, the round pads a
Electronics Forum | Wed Mar 29 13:28:45 EST 2006 | jsloot
We have been experiencing a reflow issue with a SMT diode 4007. This is a SMA or DO 214-A package. It is a lead free part used with 63/37 paste no clean flux. The problem is it is not consistant. 100 diodes can be reflowed rock solid on the board and
Electronics Forum | Thu Oct 05 15:41:36 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon. From what it sounds like is that the solder joins are not getting hot enough or if it Au, then the increase in the Au content of the joint is increasing the melting point of the final solder joint. To some extent, this will also hap
Electronics Forum | Sat Apr 14 09:28:58 EDT 2007 | davef
When soldering a component to a board, the solderability protection on the component combines with the solderability protection on the board and the solder to form an alloy. This alloy is unique for that combination of solder and solderability protec