Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Selective solder fixtures protect bottom side SMT components & eliminate the risk of loosing parts in the solder. Our unique designs will eliminate skipping and bridging. No need to tape areas which reduces operator time and speeds up your line.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2014-08-05 17:29:07.0
Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2019-06-09 19:16:34.0
Thermaltronics USA including the award-winning TMT-9800S soldering robot, announces the development and introduction of a new range of new soldering tips designed specifically for difficult soldering applications.
Industry News | 2010-09-26 15:58:03.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its Through-Hole Solder Training Kits are an economical and reliable way to ensure that each student and each class receives the same project materials and as a result consistent skills training.
Technical Library | 2013-03-27 23:43:40.0
Vapor phase, once cast to the annals’ of history is making a comeback. Why? Reflow technology is well developed and has served the industry for many years, it is simple and it is consistent. All points are true – when dealing with the centre section of the bell curve. Today’s PCB manufacturers are faced with many designs which no longer fall into that polite category but rather test the process engineering groups with heavier and larger panels, large ground planes located in tricky places, component mass densities which are poorly distributed, ever changing Pb Free alloys and higher process temperatures. All the time the costs for the panels increase, availability of “process trial” boards diminishes and yields are expected to be extremely high with zero scrap rates. The final process in the assembly line has the capacity to secure all the value of the assembly or destroy it. If a panel is poorly soldered due to poor Oven setup or incorrect programming of the profile the recovery of the panel is at best expensive, at worst a loss. For these challenges people are turning to Vapor Phase.
Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
Industry Directory | Consultant / Service Provider
CAD Design Software products run in the AutoCAD environment.
We have tremendous experience in using various software tools to meet your project requirements. During the development of your product, we work closely with your electrical engineers and mechanical engineers to ensure that the placement of the part
