Electronics Forum | Thu Aug 20 15:10:21 EDT 2009 | davef
Responding to your points: * The intermettalic layers [ie, Cu6Sn5, Cu3Sn] between the solder and the copper pad is the same composition with both lead free and leaded solder. The lead in solder has no impact on the intermetallic. * As you say, increa
Electronics Forum | Thu Oct 05 11:59:51 EDT 2006 | Mario Scalzo, SMT CPE
Good afternoon all! Theoretically, there should not be any issues soldering to the SN100C as the tin content of the molten paste alloy should wet to the finish with no problem. I would just ensure that the peak temperature of the joint is above the
Electronics Forum | Thu Jan 25 04:55:08 EST 2007 | greg york
Strange as we have had huge problems with Silver in Many different Assembly houses. Mainly with Nitric Acid based Silvers causing blow holes, non wetting and even the Nitric etching away the tracks on fine boards. It has been one of the main problem
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Thu Feb 22 20:34:25 EST 2007 | davef
This [ http://www.smtnet.com/library/index.cfm?fuseaction=view_article_html&file=no_hasl ] describes HASL [hot air solder leveling], as well as other common types of solderability protection. It goes on the discuss the impact of the use of these coa
Electronics Forum | Wed Sep 27 23:52:28 EDT 2006 | fctassembly
Hello Steve, Yes, there are differences in the various alloys and I have described briefly below these differences: SN100- a common name for 100% tin that is used to increase the tin content in 63/37. SN100C-Name for Tin/Copper/Nickel/Germanium all
Electronics Forum | Fri Sep 22 09:45:26 EDT 2006 | bradlanger
Greg, All the above. It looked like it was going to be a drop for SNPB HASL at first but after a few thousand boards we started running into all the problems you are describing. We first started seeing non wetting on SMT pads. The solder would wet t
Electronics Forum | Tue Oct 03 22:48:21 EDT 2006 | C.K. the Flip
It sounds as if this Sn100c HASL process is still in its infancy requiring further process development and characterization..weather its a better more active flux or a different profile... Given your situation of the Sn100c coating actually "repellin
Electronics Forum | Tue Dec 13 15:18:32 EST 2011 | ck_the_flip
DaveF, That's correct. This assembly is plain old tin-lead, but our buyer purchases the bare PCB with lead-free HASL plating. My main concern was the regular tin-lead not coalescing with the PCB plating and having a weak intermetallic. I'm not fr
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
