Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Mon Nov 01 17:13:37 EST 1999 | Mark W.
Jason, What is the revision of IPC you are referring too?? IPC 610 rev. b requires 75% fill on classes 2 & 3. Class 2 does allow the exception of 50% fill if the PCB has a Metal Core or Thermal/Heatsink Plane provided that the solder extends 360 de
Electronics Forum | Thu Sep 16 09:07:20 EDT 1999 | Chris McDonald
We have a new custumer that needs thier thru-hole/smt boards conformally coated. We currently do not have a selective spraycoating system adn this low volume of these board do notwarrant a 100k machine. We are spending way to much time masking and un
Electronics Forum | Tue Jan 05 18:19:40 EST 1999 | Dave F
| I'm looking for information on a company called AI Technologies. They make conductive adhesives and thermal management materials for attaching dice and heatsinks. Any feedback from users would be appreciated. Thanks, | | Chrys | Hey Chrys: I
Electronics Forum | Fri Jun 12 11:15:50 EDT 1998 | Ryan Jennens
Hey all! The wave solder warrior is back. I have found a flux which leave almost no residue (the least yet), but because of its super low solids content I absolutely cannot get topside fillets. The multi-layer, two sided board is on a pallet w
Electronics Forum | Wed Nov 06 08:59:51 EST 2002 | rmorford
This defect is there after reflow. My first thought was that the boards had some sort of contamination, too. This is a new PCB manufacturer for this board (they have been making other boards for us). But... why only on the connectors -- why only o
Electronics Forum | Mon Oct 13 15:34:22 EDT 2003 | John
Anyone ever noticed a difference in measuring the temperature on a soldered board vs. using an unsoldered mole in their wave? I've been looking at the temperature of a specific part, and it reads much higher on an unsoldered mole vs. a soldered mole
Electronics Forum | Wed Apr 13 08:01:32 EDT 2005 | Bryan
Can you please decrease the ramp rate of your reflow profile?In my opion,if you heat the pin too fast,the solder will drop for the gravity and the cappilary force can't draw it back.On the row with much heatsink,this issue won't happen,that's the rea
Electronics Forum | Thu Aug 25 16:50:13 EDT 2005 | Mark
I have an application that requires soldering pieces of metal (copper plate and copper fins to make a heatsink). Each piece is about 1 lb. I cannot test it in our reflow oven (5 zone) since the piece is about 3" in height. Has anyone attempted to
Electronics Forum | Tue May 02 13:57:21 EDT 2006 | patrickbruneel
What you can do is perforate the board holding rim by drilling holes of 0.6mm (similar to via's). This will reduce the mass and heatsinking capacity, allow excess flux drainage and facilitate convection heat contacting the board through the holes. Th
