Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Electronics Forum | Sat Feb 06 07:39:30 EST 1999 | Wayne Bracy
| | | I am looking for a piece of equipement that can | safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap. | | | | |
Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon
| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther
Electronics Forum | Thu Apr 09 22:50:50 EDT 1998 | Larry
Configuration of our HP 3065 in-circuit tester: HP3065 HL testhead with CL+ controller with 2 hard drives and tape drive 11 Hybrid cards 4 Analog cards 1 GP relay card 2 DUT power supplies (6038A) 1 HP color terminal (2397A) 2 HP terminals (700/92 an
Electronics Forum | Mon Apr 20 10:20:37 EDT 1998 | Joyce Hughes
| | Configuration of our HP 3065 in-circuit tester: | HP3065 HL testhead with CL+ controller with 2 hard drives and tape drive | 11 Hybrid cards | 4 Analog cards | 1 GP relay card | 2 DUT power supplies (6038A) | 1 HP color terminal (2397A) | 2 HP t
Electronics Forum | Wed Aug 14 13:54:54 EDT 2002 | DenM
Larry, You can try one of two approaches, a bake above 100C will drive off moisture or use a vacuum bake. The vacuum bake process is slow since there is less/no air to conduct the heat. In the hybrid industry the standard vacuum bake was 16 hours at
Electronics Forum | Tue Dec 17 08:38:30 EST 2002 | Randy Villeneuve
Jim, In most cases if you can eliminate a process you will save money. With that in mind, an all surface mount or all through hole design is prefered. There are alternatives to that rule, like hybrid designs that can be pin and paste soldered. It al
Electronics Forum | Fri Apr 14 07:59:42 EDT 2006 | amol_kane
Hi russ, I am in the process of developing a "hybrid" reflow profile to solder a board that has LF BGAs and leaded solder. Have you encountered a similar situation before? if so what was the "safe" top side temp for the leaded components that was set
Electronics Forum | Tue Mar 20 10:27:36 EDT 2007 | davef
Print styles: Print - Most common print mode * A single print stroke forward on first board * A single print stroke reverse on next board Print-Print (Double Print) * Both forward and reverse printing strokes * Helps to ensure complete filling of th
