Electronics Forum | Wed Apr 29 02:57:05 EDT 2015 | jandon
Immersion tin is very sensitive for handling, scratches, storage condition and time, thermal influence and washing. You will get problems in second reflow if you have double sided PCB with immersion tin surface finish.
Electronics Forum | Thu Aug 03 07:47:38 EDT 2017 | mgsmtnet1210
Hello Everyone, Does any one know supplier of Immersion Tin plating solution in North America? Thank you in advance.
Electronics Forum | Thu Apr 20 17:51:14 EDT 2006 | Don
Immersion tin, if it is being correctly identified, is not a final surface finish for a bare board. White tin is typically the way a finish is refered to. Either way tin has gotten a very bad reputation via a couple satellite failures because of tin
Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English
Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper
Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir
Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll
Electronics Forum | Thu Jul 14 16:05:55 EDT 2005 | russ
Good answer slthomas! This has got to be the biggest misconception out there. To perform SPC on a wave process you must first perfrom DOE to determine the critical parameters and or control limits. For example you will need temp reading devices tha
Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B
We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone
Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Tue Mar 07 15:17:25 EST 2000 | Steve Schrader
Is there an industry standard IPC spec. that I should reference on my fab drawings for Immersion White Tin?
Electronics Forum | Tue Mar 07 15:17:25 EST 2000 | Steve Schrader
Is there an industry standard IPC spec. that I should reference on my fab drawings for Immersion White Tin?
