Events Calendar | Wed Jun 05 00:00:00 EDT 2019 - Wed Jun 05 00:00:00 EDT 2019 | Chicago, Illinois USA
ITI and IPC Conference on Emerging & Critical Environmental Product Requirements
Events Calendar | Thu Apr 16 00:00:00 EDT 2020 - Fri Apr 17 00:00:00 EDT 2020 | ,
Smart Fabrics Virtual Summit 2020
Events Calendar | Thu Aug 06 00:00:00 EDT 2020 - Thu Aug 06 00:00:00 EDT 2020 | ,
Building Enriched Customer Relationships: What's my selling Style?
Events Calendar | Wed Mar 03 00:00:00 EST 2021 - Wed Mar 03 00:00:00 EST 2021 | ,
Are Humidity Indicators Part of Your Supply Network?
Events Calendar | Tue Mar 23 00:00:00 EDT 2021 - Tue Mar 23 00:00:00 EDT 2021 | ,
Dallas Chapter: Tech-Day
New Equipment | Cleaning Equipment
QYSMT MOREL Fully automatic nozzle cleaning machine-XMN-24 During the SMT process, the nozzle is easy to stick to solder paste or dirt, etc. If it is not maintained for a long time or the cleaning is not thorough during maintenance, the solder pas
New Equipment | Cleaning Equipment
QYSMT MOREL Fully automatic nozzle cleaning machine-XMN-24 During the SMT process, the nozzle is easy to stick to solder paste or dirt, etc. If it is not maintained for a long time or the cleaning is not thorough during maintenance, the solder pas
Technical Library | 2019-06-12 10:33:58.0
The success of ball grid array (BGA) placement on electronic assemblies is as much a matter of proper preparation and planning, as it is technique. In some designs, it is more appropriate to apply BGAs using a rework station that isolates the placement of the device, without subjecting the entire assembly to thermal reflow. This is especially beneficial in board constructions where the number of BGAs is limited, and the application of the solder paste is difficult, due to small pitch features that stretch the limitation of the stencil construction. Another application for rework stations, involves very large and thermally conductive BGAs, which will not uniformly reflow with other components on the assembly, and may require special process parameters for their proper placement. The most common use of BGA rework stations are for assemblies requiring BGA removal and replacements due to failures in the initial assembly stage.
Technical Library | 2019-06-19 11:06:46.0
Tin (Sn) metal displays the characteristic of growing “tin whiskers” from pure tin coatings (most actively on relatively thin, electrodeposited or immersion tin coatings), usually months or years from the initial deposition of the tin. Tin whiskers are electrically conductive, filamentary, single crystals of white (beta phase) tin. These filaments of single crystal tin are usually one to five microns in diameter, and a few microns up to several tens of millimeters long, that grow spontaneously from the tin coatings. Alloying additions of several percent (by weight) of lead (Pb) prevents these electrically conductive tin whiskers from growing. Pb alloyed into the Sn was discovered to prevent the occurrence of tin whiskers in electronic assemblies in the 1950s as the Bell Laboratories solution to the problem of tin whiskers. The alloying of the tin with lead has thus quietly averted incalculable losses from short circuits in electronic equipment for the last 60 years.
Technical Library | 2019-07-11 11:07:08.0
Affordability is not exactly the primary word which comes to mind when discussing the use of design of experiments (DOE) principles, but is generally accepted as a necessary part of the engineering activities required in the development of a product or process. However, a number of studies have indicated that the cost savings derived from a well deliberated experimental design can be substantial in the initial stages where the conditions or parameters of a process are determined. Some studies have shown a greater than 50% cost savings compared to the more conventional means of trial and error approaches to process development. At ACI Technologies (ACI), we have found the use of DOE techniques fundamental in eliminating extraneous costs otherwise spent on unnecessary testing.
