Electronics Forum | Thu Nov 10 16:15:52 EST 2005 | 1st Article
Sumote, I suggest DESCO ESD safe het gloves, these gloves have a polyester exterior fabric with woven conductive fibers to ensure static protection. Inner lining constructed of material for use in heat assembly processes, can with stand 200�F maximum
Electronics Forum | Thu Nov 10 16:19:42 EST 2005 | 1st Article
Dear Sumote, I would suggest DESCO ESD safe heat gloves, we are using them at our facility, these gloves have a polyester exterior fabric with conductive fibers to ensure static protection. Inner lining constructed of material for use in heat of 200�
Electronics Forum | Tue Nov 22 16:22:27 EST 2005 | moonshine
That is funny if you have a cable guys view of the world - and just what is that? I'm always trying to see things from a new perspective. Don't worry if you can't read because my site has so many simple pictures for you. MoonMan
Electronics Forum | Thu Aug 24 03:20:36 EDT 2006 | aj
we had problems with fillets and shifting aswell,but the recommended print aperture is reduce thermal pad by 35% and offset the lead print by 3thou...i.e. 3thou over hang on outer edge of lead which also moves the paste 3thou in from the inner edge .
Electronics Forum | Fri Jun 08 18:27:03 EDT 2007 | jmelson
This is probably an inner plated layer of the component that did not bond well. It may be a component that either has the wrong surface finish for lead-free or can't handle the temperatures. Many times I have seen a similar-looking layer when the l
Electronics Forum | Thu Apr 24 20:52:03 EDT 2008 | davef
Use of a hot air gun to reflow solder that passes tests [after failing those tests] seems to indicate the standard process reflow was inadequate. To understand this better, we'd want to measure temperatures at various points on the board during reflo
Electronics Forum | Wed Apr 28 12:08:02 EDT 2010 | tjg
Our latest designs are flip chip on flex based and we have issues with delamination/blistering. We know it is related to our vapor solvent (n-Propyl Bromide based) attacking an inner layer adhesive. Has anyone else ever heard of something like this?
Electronics Forum | Wed May 19 17:54:41 EDT 2010 | gregcr
I have had problems corrected by swapping or replacing the power supplies in the box. Do you have a second GSM that runs the AIS3500 box? If so swap the power supply and see if the problem follows the swap. I have replaced the supplies inside the
Electronics Forum | Mon Aug 30 10:39:08 EDT 2010 | jamesc09
Is there any way to measure the copper oxide thickness on the inner layers of a PCB? I have been asked to investigate this and am not sure if it is possible. If it is, please tell me by what method, any contract labs that can do it, or the name of
Electronics Forum | Mon Sep 20 00:51:03 EDT 2010 | jeffr
This particular Yamaha Head I/O Board is a common failure. Yamaha supply an updated version which is less likely to fail. The cause of the problem that you see is due to the connectors on the flexing and damaging the inner layers of the board. The on