Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes
In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Wed Oct 19 13:32:12 EDT 2005 | shk5678
I have a couple of customers I showed this to and they were impressed with the capability but didn't know the price yet. Reason being was the control of the amount of paste applied to the pads could be adjusted. They both said they had problems with
Electronics Forum | Thu Sep 07 10:32:12 EDT 2006 | slthomas
Is the solder reflowing on the pad but not wicking up the lead, or does there appear to be insufficient solder to wet both, or is it not reflowing at all, or.....? Have you verified your profile? What is the condition of your paste (expiration date,
Electronics Forum | Mon Oct 09 10:58:26 EDT 2006 | Matt Smith
Over the past several months we have experienced intermittent problems with wave solder voids on PCBs coated with OSP. We suspect variation in the OSP application process, or oxidation of the surface due to insufficient or degraded OSP. Is there a me
Electronics Forum | Mon Jul 13 07:10:17 EDT 2009 | hcarrasco
1.- If you are using polyurethane squegges , they ned to be changed. 2.- Verify your printing parameters of pressure & Speed , It seems that your pressure & speed are high. 3.- If you are seeing excess in one side and insufficiency in the opossite
Electronics Forum | Fri Mar 06 10:11:02 EST 2015 | eezday
Hello Adriano, I see that you have ran several test with differnt valumes of solder paste which is a reasonable path. Have you run any solderability tests? Head in pillow is usually considered a solderability problem. Also, what type of plating a
Electronics Forum | Mon May 06 12:44:50 EDT 2002 | Bob Willis
The SMART Group is starting a new project on PPM Monitoring which will be providing average PPM yield data per month free to the industry. I would like to get feedback or exchange criteria for paste printing as non exists with in IPC or similar organ
Electronics Forum | Tue Oct 10 20:14:01 EDT 2000 | Dason C
Hi! CJ. Please advise what is your pitch size ie 15.7 mil or what is your capabiliy can you build the board with pitch 15.75 mil (please note that the actual dimension of the package is 0.4mm), and how many lead on the package. The pad width of Ind
Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo
We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)
