Electronics Forum | Tue Sep 16 23:58:03 EDT 2003 | iman
interesting! I recently invested a small personal fortune into books nad other related literature to boost my understanding the scientific properties of materials used in electronics and interconnection packages. One area( one of many areas) of p
Electronics Forum | Wed Nov 12 08:35:16 EST 2003 | davef
2% should have no effect [recognizing that some RF deign implementations are squirrellyand they don't count]. We still use 2% dating back to the old days when the gray beards [at that time] felt that the silver improved skin effect [a tendency for a
Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN
What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti
Electronics Forum | Tue Jul 19 06:33:56 EDT 2005 | Rob
Hi GS, Thanks for responding - looks like we already put end termination coating on the label - we just call it "second level interconnect" There is a specimen label at: http://www.anglia.com/quality/labels.pdf Regarding standardising labels accr
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
Electronics Forum | Thu Nov 17 20:23:55 EST 2005 | davef
We're with your customer. We believe inner layer separation is not linked to a heating excursion. What you are seeing is separation between the hole wall and the copper plating in the barrel of the hole on an unstressed PTH. Although, it's possibl
Electronics Forum | Fri Mar 24 13:35:53 EST 2006 | bvdb
If one considers that a computer used to fill a good sized room and now can sit in/on your hand I would say that the electronics industry has already greatly reduced the use of lead. Microelectronics keeps getting smaller with fewer interconnects
Electronics Forum | Sun May 28 10:35:08 EDT 2006 | mika
Mr/Mrs/Ms SMT Guru Consultant Expert "Bahodium (TM) Solder: The new alloy that WCS has successfully mined. 100% RoHS compliant and the strongest, most reliable interconnect in the industry." Say what???!! I don't understand this att all! Haha, may
Electronics Forum | Mon Jan 22 11:50:07 EST 2007 | BWET
Can anyone recommend a material which can be used an a bare board: 1. Dispensed via a syringe 2. Mimmic the electrical characteristics of a trace 3. Be processed such that they do not reflow with the solder interconnect 4. Be processed such that the
Electronics Forum | Fri Aug 03 10:23:30 EDT 2007 | stepheniii
I meant have the board shop build the boards. I'm not talking assmebly. With the Occam process it would be like waiting untill you have all the other parts then phoneing the board shop and then ordering your raw pcbs. The interconnects have to be