Electronics Forum | Fri Apr 20 07:12:22 EDT 2001 | wbu
Dougie, oh yes, it�s a bit short that chapter. I have the Revision e in front of me and this one contains in the appendix the needed IPC-TM-650 Test method for bow and twist. Can�t think that they don�t have that in the new revision. Hope you find
Electronics Forum | Mon Apr 23 11:44:55 EDT 2001 | CAL
650 Standards are also located in the back of IPC JSTD-001. I am currently looking at 4 pages on bow and twist. Percent bow = R1-R2/L x 100 (R1= Highest point; R2=lowest or resting point; l= length) Percent twist=(R1-R2)/(2xL)x 100 Sorry if this is
Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach
| What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | Thanks, | | Frank | Frank, Refer to the device manufacturers. they are going to have a recomme
Electronics Forum | Mon Nov 12 17:12:40 EST 2001 | slthomas
Thanks, Dave. Three courtesy cheers for specifications written to reflect the capabilities of the part suppliers, even if they fail to meet the purchaser's (not unreasonable) process req'ts. In the meantime, I'm sure my stencil guy would be more
Electronics Forum | Mon Jun 12 18:44:30 EDT 2006 | muse95
OK, Pete, I just looked all through IPC-A-600G. Saw no mention of scoring anywhere. Please provide specific section number info. Thanks By the way, Chris, thank you for the information - that is really interesting stuff. Would you be willing to a
Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis
| | What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? | | | | Thanks, | | | | Frank | | | Frank, | Refer to the device manufacturers. they are going t
Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum
Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to
Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds
Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.
Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
IPC is the trade association for the printed wiring board and electronics assembly industries.
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