Electronics Forum | Wed Aug 19 05:00:56 EDT 1998 | Tom Blum
Hi there, I'm actually facing a lot of trouble with PCB's presenting up to 3mm of bow /twist at reception i.e. before assembly. The PCB size is 220 by 230mm. The boards are to be assembeled SMD double sides with 05.mm pitch on both sides. In order to
Electronics Forum | Mon Mar 28 22:29:42 EST 2005 | msivigny
Appreciate the feedback SMTUser & link referral PeteC! Late 2004, EAGLE-EYED ONE changed its name to CeTaQ Americas. Still the same business, people and quality products and services. Changed for global synergy with our German parent and in support o
Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds
Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.
Electronics Forum | Mon Jan 15 11:41:56 EST 2007 | davef
Questions are: * Does the component take solder when you dip it in the solder pot to test the solderability of the leads? * Can you get full barrel fill when wave soldering a bare board? * Is your flux reaching the top of the board through the hole b
Electronics Forum | Mon Nov 12 16:14:47 EST 2001 | davef
Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!! IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Electronics Forum | Sat Jun 05 08:18:03 EDT 2004 | vinitverma
Hi Grant, If you're really looking for speed, I'm sure you're looking for another machine for doing the QFPs, BGAs stuff etc. In that even, why not have a look at the long proven Assembleon FCM machine!! It is a totally different concept with UNMATC
Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef
I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,
Electronics Forum | Tue Jan 16 07:07:17 EST 2007 | tk380514
Answers: The component does take solder, no problem We get a full barrel fill with an empty PCB but only on one of the holes, the other hole has so much copper around it. The flux reached the top of the PCB when I tested the empty PCB. The IPC-A-610
Electronics Forum | Thu Oct 20 20:44:15 EDT 2011 | davef
Design based on: * IPC-SM-782A: Gap 0.0157", Pad 0.0354"X0.0276" [along gap] * IPC-SM-782A Mod used on 32411A1 & Volvo Smart Switch: Gap 0.0157", Pad 0.020"X0.020" [along gap] * IPC-7351: Gap 0.008", Pad 0.0256"X0.0256" [along gap]
Electronics Forum | Fri Feb 06 03:56:47 EST 2004 | JaMi Smith
BGAs and QFPs packaged in Trays are oriented with Pin 1 or corner A1 oriented towards the Pin 1 identifier on one corner of the Tray, which is usually identified by a chamfered corner. The Trays themselves are usually governed by JEDEC Registered Ou
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