Electronics Forum | Fri Oct 12 12:12:13 EDT 2018 | davidsmullins
We have some fairly standard 0.1" pitch, two row, shrouded, through hole headers soldered onto a thick backplane. There are tiny inspection holes along the bottom edge of the plastic body that allow an inspector to observe the top of the through hole
Electronics Forum | Tue Mar 13 09:29:44 EDT 2007 | realchunks
Hi Long, Cmiller is right, check out the vendors and ask for lots of info, they'll flood you with it. You also mite ask to see their equipment working in a facility near you. Also check out IPC-A-610 and J-STD-001. Get to know the different termi
Electronics Forum | Tue May 28 13:14:31 EDT 2002 | zanolli
Hello Mark, I'll assume that you are currently wave soldering and would like to eliminate that operation by using pre-forms or press-fit connectors. Solder preforms or solder flux bearing connector leads usually do not require any hole size changes,
Electronics Forum | Tue May 09 14:19:52 EDT 2006 | Larry (not THAT Larry)
Smartasp - What are your lead to hole ratios like? Dial down the flux and open up the holes, if you can. Keeping at least a 14-20 mil gap between min hole/max lead solves the hole fill problem. L
Electronics Forum | Fri Apr 27 08:44:08 EDT 2007 | Brett
For those of you who use via holes as test points, and the via holes must be filled at the wave, is it necessary to have a "dome" on every single test point, or is it sufficient to have the via "filled" with solder? The ICT preson here insists that
Electronics Forum | Mon Oct 15 14:36:03 EDT 2018 | davef
The methods of verifying PTH hole-fill. 1 Visual inspection 2 x-ray inspection works very well for inspecting such a connector for voiding and hole fill. View the connector off-vertical, at between 30 and 45 degrees. As always, the solder connect
Electronics Forum | Tue Jun 20 21:30:05 EDT 2006 | davef
The minimum vertical hole fill is defined as follows: Class 1: Not specified, with a 270-degree circumferential fillet and wetting on the secondary (solder source side) of lead and barrel, and a 75% coverage of the land area on the secondary side. Cl
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
Electronics Forum | Mon Mar 04 11:08:56 EST 2002 | Matt Kehoe
We have a customer that desires to have their via holes plugged with solder after assembly. Is it possible to add the via holes to the stencil and print paste into them and expect them to plug? If so, how much paste? One to one on the stencil opening
Electronics Forum | Tue Feb 24 09:52:14 EST 2004 | davef
First, two points about hole / barrel fill are: * A filled hole is an excellent indicator of the optimum process and optimum quality PCB. * The study that showed that holes need not be filled was paid for by the US Army and performed by Lockheed in
