Electronics Forum: ipc-sm-782 (Page 8 of 8)

0402 tombstoning

Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect

We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Mon Oct 06 08:51:26 EDT 2003 | davef

The EIA does not provide that information. EIA standards focus on component dimensions. Alternately consider: ...cut... SM-782A - Surface Mount Design & Land Pattern Standard, Inc. Am. 1 & 2 ANSI Approved Get up-to-date land pattern recommendat

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon

| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |

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