Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef
J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200
Electronics Forum | Thu Aug 07 22:51:05 EDT 2008 | davef
We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement stecifies: * "IPC 610, Class 2 acceptability." This is unclear. Should this be "IPC-A-610, Class 2 acceptability?" * No class for J-STD-001. Should we a
Electronics Forum | Wed Dec 14 19:49:11 EST 2011 | joeherz
Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-001E and I have a question for those in the know. This section of the standard says the following: ----------- Electronic/mechanical components (includi
Electronics Forum | Wed Mar 06 21:16:17 EST 2002 | davef
�What does 5 micrograms of chloride mean to me?� * With SIR testing, you can show no detrimental leakage currents under humid conditions, no corrosion, no metal migration, which are the big factors in figuring out electrochemical reliability. People
Electronics Forum | Thu Jun 15 20:24:45 EDT 2000 | Jeff Tamagi
In section 7.3.2 of ANSI J-STD 001 " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles" I have contacted one board manufacturer who states that it is recommended to bake a board to remove volitles. Are
Electronics Forum | Wed May 17 05:13:22 EDT 2000 | Chris May
You can refer to ANSI/J-STD-001B section 6.4.3.1 which states: "When part stacking is permitted by the assembly drawing(s)/ documentation, parts SHALL not violate minimum electrical spacing between other parts or components such as terminals or othe
Electronics Forum | Mon Apr 10 16:18:56 EDT 2000 | Mark Belec
I need some input to clear up some confusion I have with regards to what standard I should be using for workmanship on the pcb assemblies we produce. Should I be using the IPC 610b or the ANSI-J-STD-001B? What is the norm for the industry or is the
Electronics Forum | Thu May 31 10:40:30 EDT 2001 | davef
See, all those bad thoughts we had ... The guilt, how do we live with it? 3 Spec Fir Tree General Technical Specification 3a Design/Layout: IPC-2221 IPC-2222 3b PCB Fab: IPC-6011 IPC-6012 IPC-4101 IPC-A-600 3c PCB assembly: J-STD-001 IPC-A-6
Electronics Forum | Fri Apr 03 08:25:11 EST 1998 | Scott Cook
| Does anyone know what the military uses for water | soluable flux in their wave solder process: | - wave flux | - rework flux | - cored solder | and approval steps to go through to qualify it. | Any information is appreciated. Thank you. Sylvia
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