Industry News: knead and solder and paste (Page 8 of 61)

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Industry News | 2017-05-15 16:35:00.0

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

SMTA China Presents Nine Best-Paper / Oustanding Paper / Best Presentation Awards and Two Best Exhibit Awards at SMTA China East 2016 Conference / Nepcon China 2016

Industry News | 2016-05-09 21:21:15.0

SMTA China announces that it presented awards for Nine papers at the SMTA China East 2016 Conference Award Presentation Ceremony, held on Tuesday, April 26, 2016 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

Surface Mount Technology Association (SMTA)

IPC APEX India — Launch of More Than a Premier Conference and Exhibition Nearly 1,000 attendees take part in inaugural event

Industry News | 2013-09-30 16:09:37.0

The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Industry News | 2013-11-01 16:09:44.0

Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

Association Connecting Electronics Industries (IPC)

Linda Woody and Stephen Tisdale Earn Dieter Bergman IPC Fellowship Awards Award honors two IPC members who have exhibited ongoing leadership

Industry News | 2018-03-07 07:41:47.0

In recognition of their ongoing leadership in developing and promoting IPC standards on a global basis, IPC – Association Connecting Electronics Industries® bestowed an Dieter Bergman IPC Fellowship Award upon Linda Woody, LWC Consulting, and Stephen Tisdale, Tisdale Environmental Consulting LLC at IPC APEX EXPO® 2018.

Association Connecting Electronics Industries (IPC)

New Kapton Film Stencils for Labs and DIYs

Industry News | 2014-01-17 12:52:25.0

BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.

BEST Inc.

MYDATA has qualified solder paste from Alpha and AIM for Jet Printing

Industry News | 2009-09-26 16:26:35.0

MYDATA announces that the two leading solder paste partners, Alpha and AIM, releases solder paste designed and qualified for the MYDATA MY500 Jet Printer.

Mycronic Technologies AB

MYDATA and Alpha to highlight new opportunities for jet printing of low-temperature solder paste at APEX 2013

Industry News | 2013-02-25 16:44:53.0

MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing.

Mycronic Technologies AB

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:01:00.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited


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