Electronics Forum | Wed Jan 06 23:01:48 EST 1999 | Dave F
| | Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socke
Electronics Forum | Wed Jan 06 21:56:37 EST 1999 | Steve Gregory
| Youse: This is SMTnet Steve. Sacrifice the socket. By the time you finish putzing-around removing the balls to get the socket off the board, replacing the lifted pads on the board, and reballing the socket; you've burnt the $100 that the socket
Electronics Forum | Tue Jun 05 03:56:52 EDT 2001 | JohnW
Flip Chip/uBGA Underfill Visual Standards The aim of this document is to produce some draft text and then select photographs to make up a draft visual standard for inspection. There is also a need to produce some reference material for C Scan image
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
Electronics Forum | Thu Sep 23 10:17:26 EDT 1999 | Earl Moon
| | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn/P
Electronics Forum | Thu Sep 23 10:29:34 EDT 1999 | Dave F
| | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no Sn
Electronics Forum | Thu Sep 23 11:35:10 EDT 1999 | Earl Moon
| | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (no
Electronics Forum | Thu Sep 23 12:30:52 EDT 1999 | Wolfgang Busko
| | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations (n
Electronics Forum | Thu Sep 23 12:43:27 EDT 1999 | Earl Moon
| | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead terminations
Electronics Forum | Sat Sep 25 08:00:11 EDT 1999 | Brian
| | | | | | | I am attemping to gather as much information on the issues with and progress in solutions for manufacturing Pb free products in response to European initiatives (WEEE). I am intereested in component issues with As Made lead termination
