Electronics Forum | Wed Aug 27 09:45:22 EDT 2003 | caldon
My initial thought (Quick and not to in depth)made me think of the solder joint integrity. I would fear solder contamination if the metal making up the plating would leach (or its elements) into the solder joint. I strongly suggest if you were to go
Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Fri Mar 26 17:12:17 EST 2004 | ben
I have recently encountered a new pcb design with a very high density of components on either side of the pcb. One of the suggested "fixes" is to use the smt pads as vias i.e. the via will be drilled thorough the centre of the smt pad. My concern i
Electronics Forum | Thu Apr 08 04:52:24 EDT 2004 | Dougie
We are concerned about the issues you mentioned and more, however we have no option but to change over due to legislation. A high percentage of our market share is in Europe and Japan, who of course have already embraced the no-lead change. We simply
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Mon May 14 13:33:36 EDT 2007 | jax
Solderability!!! The CM in question has probably seen too many solder problems with White Tin in the past. We have had the same issues. To save us from spending too much time and money(verifying pure Tin plating thickness, Chemical leaching from th
Electronics Forum | Tue Apr 14 17:39:34 EDT 2009 | gregoryyork
Sorry been away for a while. It is actually due to high boiling solvents or plasticizers leaching from the porous resist that kills the cure as it puddles out and has nothing to adhere to. We do have some wipes to check the cure and are looking to ma
Electronics Forum | Tue Jun 15 22:31:06 EDT 2010 | Mag10
Depending on the how you plug the via, the void level can significantly affected. If you have via plugged from the bottom side; i.e. opposite side of the component, you will see alot of void due to entrapped air in the via hole. I found work best wh
Electronics Forum | Tue Nov 30 18:02:45 EST 2010 | flipit
62/36/2 is used often in thickfilm hybrid circuits where Pd/Ag conductors are used. The idea is that you saturate the joint with the 2% silver and thus help eliminate the leaching of the silver from the hybrid circuit pads or the component. We mix
Electronics Forum | Wed Dec 04 12:57:01 EST 2013 | markhoch
Thank you for your reply Chris We have the same exact unit. But we've had issues with the cleaning solution leaching into the electrical cabinet and shorting out the PLC. They use a foam weather strip as the only insulation, and the cleaning solutio
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