Electronics Forum | Tue Dec 13 09:29:08 EST 2011 | swag
We're soon to build a lead free assembly with 0201 components. I'm not worried about placement as our machines can handle it. Any tips on printing, screens, reflow?
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef
Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron
Electronics Forum | Thu Nov 30 15:19:56 EST 2006 | CK the Flip
Mike, dude, I feel your pain. Hearing stories like this makes my blood boil! It's almost as ridiculous as a customer who told me to put more solder paste on a MELF component to overcome noise issues - he used more solder paste as antennas to overco
Electronics Forum | Thu Mar 10 13:05:41 EST 2005 | patrickbruneel
This phenomenon is caused by a high amount of halogens (Cl, Br etc.) used in the flux activators or in the flux surfactants. We've seen effects creating all colors of the rainbow. Changing to No-Clean (halide-free) will eliminate this color effect.
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef
We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a
Electronics Forum | Wed Nov 29 10:10:50 EST 2006 | M. Sanders
I'm sorry, Dave - I didn't make myself very clear. Yes, this space (not really a "gap") is filled with solid solder. For instance, if you place a gull-wing component in solder paste, after reflow, there will probably be a thin film of solidied solder
Electronics Forum | Tue Nov 28 09:21:58 EST 2006 | Michael Sanders
Is anyone aware of any articles, white papers, etc., that discuss the gap between the lead and the pad after a SM joint is soldered? In particular, I am looking for a formula for that "gap" for various components.
