Electronics Forum | Wed Aug 12 14:37:41 EDT 2009 | davef
Try this: http://www.pwbrc.org/members/pdf/works99/Hua.PDF
Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Mon Dec 20 16:22:45 EST 2010 | rkondner
When you say Fine Pitch is this .5mm or is it smaller? I wonder what problems they experienced with HASL, the only problem I recall hearing was the surface was not flat. When applying paste with a stencil I can not see how the flatness is an issue.
Electronics Forum | Wed Feb 21 14:14:11 EST 2007 | rgduval
Hi, Bill, Lead-free solder and paste manufacturers will be a great resource for you during the transition; they've tested their products extensively, and their application groups have been able to help me through the biggest changes. There are a fe
Electronics Forum | Tue Feb 27 13:43:42 EST 2007 | wavemasterlarry
Thanks Russ. Everyone knows that when you clean your wave you wear a dust mask. Well that tells ya the lead is flying around. So same goes fr your oven. Hot solder paste turns into the lead. And like a wave it is very hot. Hot stuff vaporizes l
Electronics Forum | Tue Sep 11 22:40:26 EDT 2007 | philip_yam
We are testing SAC paste for thru-hole components in the 2nd reflow process. The solder joint is alright but some problem encountered in FR1 or CAM2 PCB after multiple times of reflow due to the temperature. We are very interested in Zn or Bi-based l
Electronics Forum | Fri Dec 08 21:23:16 EST 2006 | Harsha
I am seeing a problem of flux droping on the PCBA during reflow. This is a pb free process and I am using KOKI pb free paste with 8 zone (and some 9 zone) reflow ovens. Line throughput is about 10,000 boards/24 hours. I suspect that the exhaust is no
Electronics Forum | Wed Dec 22 07:20:21 EST 2010 | piter
HI I used both of solder leveling HASL and ENIG, HASL I can recommended for biger pitch is cheaper solder leveling than ENIG but problem with that solder leveling is during the reflow process HASL isn't flat and during reflow process component move
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
